Electronic component test apparatus

ABSTRACT

An electronic device testing apparatus for conducting a test by pressing input/output terminals of electronic devices to be tested against contact portions of a test head portion ( 100 ) while loading the electronic devices to be tested on electronic device conveying media ( 11, 12, 13, 14 ) by a moving means: wherein two electronic device conveying media ( 11, 12 ) loaded with electronic devices to be tested are gripped by one moving means and two electronic device conveying media ( 13, 14 ) loaded with electronic devices to be tested are gripped by the other moving means at a time, and the respective moving means independently conveys to and from the contact groups.

TECHNICAL FIELD

The present invention relates to an electronic device testing apparatusfor testing an electronic device, and an electronic device testingapparatus capable of conducting a test with a high testing efficiencydue to provision of a plurality of moving means for conducting a test bygripping a plurality of electronic device conveying media loaded withelectronic devices to be tested at a time.

BACKGOUND ART

In an electronic device testing apparatus called a handler, a largenumber of electronic devices held on a tray are conveyed into theelectronic device testing apparatus, and the respective electronicdevices are brought to electronically contact a test head for conductinga test by an electronic device testing apparatus body (hereinafter, alsoreferred to as a tester). When the test is finished, the electronicdevices are taken out from the test head and reloaded to trays inaccordance with the test results so as to be classified to categories ofgood ones and defective ones, etc.

In conventional electronic device testing apparatuses, there is a typewherein a tray for holding pre-test electronic devices or holdingpost-tested electronic devices (hereinafter, also referred to as acustomer tray) differs from a tray conveyed by circulating inside theelectronic device testing apparatus (hereinafter, also referred to as atest tray). In an electronic device testing apparatus of this kind,electronic devices are reloaded between the customer tray and the testtray before and after the test, and the electronic devices are pressedagainst a test head in a state of being carried on the test tray in atest step for conducting a test by bringing the electronic devices tocontact the test head.

On the other hand, there is known a type wherein electronic devices heldon a customer tray are applied with a thermal stress by using a heatplate, etc., then, some of them are picked up by suction heads at atime, conveyed to a test head, and brought to electronically contact. Ina test step of an electronic device testing apparatus of this kind,electronic devices are pressed against the test head in a state of beingpicked up by the suction heads.

When being pressed, a large number of contact portions are provided tothe test head (Normally, the number of test positions capable ofmeasuring at a time, that is, the simultaneously measured number islimited to 2^(n), such as 32 or 64, per one electronic device testingapparatus. Note that “n” is a natural number), and by conducting testson a large number of electronic devices at a time, tests with highthroughput are conducted.

Conventionally, when conducting tests on electronic devices, the testhas been conducted in a final step of production steps of the electronicdevices, so that a test has been conducted on completed electronicdevices after steps of molding and wire bonding, etc. are finished.

However, when judged to be defective by the test after finishing theproduction steps, steps up to the completion after becoming a state ofbeing ready for the test may be wasted, so that it is preferable thatthe test is conducted when it became to be in the state of being readyfor the test and the defectives are taken away at this stage.

In the production steps of electronic devices, as shown in FIG. 24, dueto limitation of the nature of the electronic device, the electronicdevices to be tested 20 are loaded on an electronic device conveyingmedium of strip formats 10, etc. (a strip format of four rows by elevencolumns in the case of FIG. 24) for preventing the electronic devices 20from parting for conveying within and between respective steps.Accordingly, to conduct a test on electronic devices 20 in a state itbecame ready for the test before reaching the final step, the test hasto be conducted while the electronic devices 20 are loaded on theelectronic device conveying medium 10, furthermore, the arrangement ofthe electronic devices 20 on the electronic device conveying medium 10has to be kept to be conveyed to the next step. Note that there arearbitrary number and arrangement of the electronic devices to be tested20 on the electronic device conveying medium 10.

Also, contact portions 110 a of a test head of the conventionalelectronic device testing apparatus composed only one contact group 110composed of the contact portions 110 a by the simultaneously measurednumber limited in the electronic device testing apparatus as shown inFIG. 25 and FIG. 26. FIG. 25 shows one contact group 110 configured thatthe number of the contact portions 110 a is limited to 32, and FIG. 26shows one contact group 110 configured that the number of the contactportions 110 a is limited to 64.

Therefore, for example as shown in FIG. 27, when securing test positionswith the simultaneously measured number of 32 for the electronic devicesto be tested 20 loaded on the electronic device conveying medium 10, itis possible to secure test positions of 32 in the first round test(Post-tested electronic devices 21 in FIG. 27 show all of 32 blacksquares in the figure), while only remaining 16 test positions can besecured in the second round test (Pre-test electronic devices 22 in FIG.27 show all of 16 white squares in the figure). Thus, only half thenumber of the 32 contact portions is used in the second round test, sothat there was a problem that the test efficiency declines.

For these problems, to always secure the simultaneously measured numberof 32 regularly on the electronic device conveying medium 10, it isconsidered, for example, one contact group 110 composed of 32 contactportions 110 a is divided to 32 contact groups, and 32 electronic deviceconveying media 10 are conveyed at a time to conduct a test onelectronic devices to be tested 20 loaded on the electronic deviceconveying media 10 at a time. In this case, the apparatus is liable tobe huge and complicated, so that it is more preferable to secure thesimultaneously measured number with as few electronic device conveyingmedia 10 as possible.

Alternately, for example, a method of dividing 32 contact portions 110 ato some contact groups 110 and setting an independent moving means toeach of the contact groups 110 is also considered to always secure asimultaneously measured number with as few electronic device conveyingmedia 10 as possible. However, when the number of the contact groupsexceeds a certain degree, it may cause an increase of facility costs.

Furthermore, for example, a method of dividing 32 contact portions 110 ato some contact groups 110, collectively moving all electronic deviceconveying media 10 by one moving means, and providing a moving means forconducting a test may be also considered for always securing thesimultaneously measured number. However, since a large number ofelectronic device conveying media 10 are collectively gripped, therearises a problem that the larger the number of electronic deviceconveying media 10, the more difficult it becomes to secure alignmentaccuracy of the respective electronic devices 20 and the contactportions 110 a.

The present invention was made in consideration of the above problems ofthe prior art and has as an object thereof to provide an electronicdevice testing apparatus capable of conducting a test with a high testefficiency on electronic devices to be tested loaded on a plurality ofelectronic device conveying media by arbitrary number and in anarrangement thereof.

DISCLOSURE OF THE INVENTION

To attain the above object, an electronic device testing apparatus ofthe present invention is an electronic device testing apparatus, forconducting a test by pressing input/output terminals of electronicdevices to be tested against contact portions of a test head by a movingmeans while the electronic devices to be tested are loaded on anelectronic device conveying medium, comprising one or a plurality of themoving means capable of gripping and conveying to and from the contactportions a plurality of the electronic device conveying media loadedwith the electronic devices to be tested at a time.

In the electronic device testing apparatus of the present invention, amoving means is not provided independently to each of contact groups ora moving means for collectively gripping all contact groups is notprovided, but a plurality of moving means capable of gripping aplurality of electronic device conveying media loaded with electronicdevices to be tested at a time and conveying them to and from contactportions are provided, so that an increase of the facility cost and anexpansion of the occupying area are suppressed, the simultaneouslymeasured number is always secured while securing alignment accuracy, anda high testing efficiency can be realized.

Also, an electronic device testing apparatus of the present invention isan electronic device testing apparatus wherein the moving means iscapable of freely selecting the gripping number within a number able tobe gripped.

By suitably selecting the gripping number within the number able to begripped by the moving means in accordance with an arbitrary number andarrangement of electronic devices to be tested on the electronic deviceconveying medium, the simultaneously measured number can be secured anda high testing efficiency can be realized.

Also, in the electronic device testing apparatus, the one moving meansis capable of freely selecting the gripping number independently fromother moving means.

By freely selecting the gripping number by the moving means on a testhead and combining them among a plurality of moving means on the testhead, a moving method can be flexibly matched to a production plan orother situation changes, the simultaneously measured number can bealways secured, and flexible countermeasure becomes possible to realizea high testing efficiency.

Also, the any two or more moving means among the plurality of movingmeans have a substantially overlapping operation range on a contactgroup as a set of the contact portions.

Due to provision of any two or more moving means having an operationrange substantially overlapping on a contact group as a set of contactportions, the respective moving means operate in turn for the contactgroup, so that a part of index time in one moving means can be absorbedin test time of other moving means.

Note that the test time indicates time from transmission of a startrequest signal to a contact portion wherein pre-test electronic deviceson an electronic device conveying medium are set until an output of atest end signal after conducting a test. The index time indicates timefrom transmission of a test end signal from the contact portion till anoutput of a start request signal by the moving means after moving theelectronic device conveying medium loaded with post-test electronicdevices and setting pre-test electronic devices on the next electronicdevice conveying medium to the contact portion. Furthermore, a test rateis made up by a sum of the test time and the index time and is theshortest time from an output of a start request signal by the movingmeans till an output of the next request signal.

Particularly, when the test time is short, the ratio occupied by theindex time in the test rate becomes large, so that high throughput canbe realized by conducting tests on a range having a contact group by aplurality of moving means in turn.

The electronic device conveying medium in the present invention includesall media for loading electronic devices to be tested.

For example, in the electronic devices testing apparatus as set froth inclaim 5, the electronic device conveying medium is a strip format or awafer. When conducting a test on electronic devices on a wafer, a hightesting efficiency is realized near the outer circumference where testpositions by the simultaneously measured number are hard to be secured.

According to the above explained present invention, it becomes possibleto optimally determine the optimal number of contact groups on a testhead, the number and arrangement of contact portions in each contactgroup, and the number of independent moving means based on the numberand arrangement of electronic devices to be tested on an electronicdevice conveying medium and a production plan, etc.; and it becomespossible to optimally determine a contact group corresponding to eachmoving device, the number of electronic device conveying media able tobe gripped by each moving device, the freely gripped number ofelectronic device conveying media within the number able to be grippedby each moving device being independent from other moving devices. As aresult, the simultaneously measured number can be always secured, andtests can be conducted with a high testing efficiency on electronicdevices to be tested loaded on a plurality of electronic deviceconveying media.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic view of a first embodiment of the presentinvention.

FIG. 2 is a view of a test head portion 100, detailed configurationaround it and the control system of the first embodiment of the presentinvention.

FIG. 3 is a schematic view of corresponding relationship of anelectronic device conveying medium and each contact group whenconducting a test on electronic devices to be tested on one electronicdevice conveying medium in the simultaneously measured number of 32.

FIG. 4 is a view showing an arrangement of each contact group whenconducting a test on electronic devices to be tested on one electronicdevice conveying medium in the simultaneously measured number of 32.

FIG. 5 is a view showing test positions in the first round of electronicdevices to be tested arranged on an electronic device conveying mediumwhen conducting a test on electronic devices to be tested on oneelectronic device conveying medium in the simultaneously measured numberof 32.

FIG. 6 is a schematic view of corresponding relationship of anelectronic device conveying medium and each contact group whenconducting a test on electronic devices to be tested on two electronicdevice conveying media by using the same moving device in thesimultaneously measured number of 32.

FIG. 7 is a view showing an arrangement of each contact group whenconducting a test on electronic devices to be tested on two electronicdevice conveying media by using the same moving device in thesimultaneously measured number of 32 by using the same moving device.

FIG. 8 is a view showing test positions in the first round of electronicdevices to be tested arranged on electronic device conveying media whenconducting a test on electronic devices to be tested on two electronicdevice conveying media by using the same moving device in thesimultaneously measured number of 32.

FIG. 9 is a schematic view of corresponding relationship of electronicdevice conveying media and each contact group when conducting a test onelectronic devices to be tested on two electronic device conveying mediaby using a different moving device in the simultaneously measured numberof 32.

FIG. 10 is a view showing an arrangement of respective contact groupswhen conducting a test on electronic devices to be tested on twoelectronic device conveying media by using a different moving device inthe simultaneously measured number of 32.

FIG. 11 is a view showing test positions in the first round ofelectronic devices to be tested arranged on electronic device conveyingmedia when conducting a test on electronic devices to be tested on twoelectronic device conveying media by using a different moving device inthe simultaneously measured number of 32.

FIG. 12 is a view showing corresponding relationship of electronicdevice conveying media and respective contact groups when conducting atest on electronic devices to be tested on three electronic deviceconveying media in the simultaneously measured number of 32.

FIG. 13 is a view showing arrangements of respective contact groups whenconducting a test on electronic devices to be tested on three electronicdevice conveying media in the simultaneously measured number of 32.

FIG. 14 is a view showing test positions in the first round ofelectronic devices to be tested arranged on electronic device conveyingmedia when conducting a test on electronic devices to be tested on threeelectronic device conveying media in the simultaneously measured numberof 32.

FIG. 15 is a view showing corresponding relationship of electronicdevice conveying media and respective contact groups when conducting atest on electronic devices to be tested on four electronic deviceconveying media in the simultaneously measured number of 32.

FIG. 16 is a view showing arrangements of respective contact groups whenconducting a test on electronic devices to be tested on four electronicdevice conveying media in the simultaneously measured number of 32.

FIG. 17 is a view of test positions in the first round of electronicdevices to be tested arranged on electronic device conveying media whenconducting a test on electronic devices to be tested on four electronicdevice conveying media in the simultaneously measured number of 32.

FIG. 18 is a view showing a detailed configuration of a test headportion and around it of the second embodiment of the present invention.

FIG. 19 is a view showing an arrangement of respective contact groupswhen conducting a test on electronic devices to be tested on twoelectronic device conveying media in the simultaneously measured numberof 32 of the second embodiment of the present invention.

FIG. 20 is a view showing test positions in the first round arranged onelectronic device conveying media when conducting a test on electronicdevices to be tested on two electronic device conveying media in thesimultaneously measured number of 32 of the second embodiment of thepresent invention.

FIG. 21 is a view showing arrangements of respective prober groupscorresponding to a test of electronic devices arranged on a wafer in athird embodiment of the present invention.

FIG. 22 is a view showing test positions in a first prober group and asecond prober group.

FIG. 23 is a view showing test positions in a third prober group and afourth prober group.

FIG. 24 is a view showing a strip format on which electronic devices arearranged in four rows by eleven columns.

FIG. 25 is a view showing an arrangement of conventional one contactgroup composed of contact portions having the simultaneously measurednumber of 32 (4 rows by 8 columns).

FIG. 26 is a view showing an arrangement of conventional one contactgroup composed of contact portions having the simultaneously measurednumber of 64 (4 rows by 16 columns).

FIG. 27 is a view showing positions able to be measured at a time in thefirst test and the second test in the case of electronic deviceconveying media (3 rows by 16 columns).

BEST MODE FOR CARRYING OUT THE INVENTION

Below, preferred embodiments of the present invention will be explainedbased on the drawings.

Embodiment 1

FIG. 1 is a schematic view of an electronic device testing apparatus ina first embodiment of the present invention, and FIG. 2 is a viewshowing a test head portion 100, a detailed configuration of around itand the control system of an electronic device testing apparatus of thepresent invention.

The electronic device testing apparatus 1 of the present embodiment isan apparatus for conducting a test (inspection) whether electronicdevices 20 operate suitably in a state that the electronic devices to betested 20 are applied with a thermal stress of a high temperature or lowtemperature, and classifying the electronic devices 20 in accordancewith the test results; wherein an operation test in a state of applyingsuch thermal stresses is conducted by conveying an electronic deviceconveying medium 10 loaded with the electronic devices to be tested 20as test objects to the electronic device testing apparatus 1.

Therefore, the electronic device testing apparatus 1 of the presentembodiment comprises, as shown in FIG. 1, an electronic devices storingportion 800 for storing pre-test electronic devices to be tested 20 andstoring post-test electronic devices to be tested 20; a loader sectionLD for feeding electronic devices to be tested 20 fed from theelectronic device storing section 800 to a chamber section 900; achamber section 900 including a test head portion 100 for conducting atest; and an unloader section UL for taking out post-test electronicdevices 20 tested in the chamber section 900.

Electronic Device Storing Section 800

The electronic device storing section 800 is provided with a pre-testelectronic device stocker 801 for storing pre-test electronic devices tobe tested 20, a post-test electronic device stocker 802 for storingpost-test electronic devices 20, and a retest electronic device stocker803 for storing electronic devices 20 judged to be requiring a retest.

The pre-test electronic device stocker 801 comprises a supply positionLS1 of magazines MG from the previous step; a not shown conveying meansin the X-axis direction for storing a plurality of magazines MG andmoving successively to a supply position LS2 of electronic deviceconveying media 10 to the loader section LD; a supply position LS2 ofelectronic device conveying media 10 to the loader section LD; and a notshown position control means in the Z-axis direction for assistingsupply to the loader section LD.

In the pre-test electronic device stocker 801, a certain number ofelectronic device conveying media 10 loaded with pre-test electronicdevices 20 are supplied to the supply position LS1 of the magazine MGfrom the previous step in a state of carried in the magazine MG.

The magazine MG carrying a certain number of electronic device conveyingmedia 10 loaded with the supplied pre-test electronic devices 20 issuccessively moved close to the supply position LS2 of the electronicdevice conveying medium 10 to the loader section LD by the not shownconveying means in the X-axis direction, and stored with a plurality ofthe magazines MG supplied on the not shown conveying means in the X-axisdirection (in FIG. 1, for example 6 magazines MG are stored).

In the magazine MG reached to the supply position LS2 of the electronicdevice conveying medium 10 to the loader section LD by being moved bythe not shown conveying means in the X-axis direction, a first conveyingmeans 401 of the loader section LD conveys from the top of theelectronic device conveying media 10 in the magazine MG by one at a timeto the loader section LD.

At this time, in the supply position LS2 of the electronic deviceconveying medium 10 to the loader section LD, for example, an electronicdevice conveying medium 10 loaded with pre-test electronic devices 20 issupplied from the top among the electronic device conveying media 10loaded with pre-test electronic devices 20 carried in the magazine MG.It is configured that every time one electronic device conveying medium10 loaded with pre-test electronic devices 20 is supplied, the magazineMG is elevated in the Z-axis direction by a certain pitch by a not shownZ-axis actuator and a position of an electronic device conveying medium10 loaded with pre-test-electronic devices 20 on top among theelectronic device conveying media 10 loaded with pre-test electronicdevices 20 carried in the magazine MG can be always kept at the sameheight. It assists supply from the magazine MG of the electronic deviceconveying media 10 loaded with pre-test electronic devices 20 by a firstconveying means 401 of the loader section LD.

Also, the same magazine MG is used in the pre-test electronic devicestocker 801 and the post-test electronic device stocker 802. As shown inFIG. 1, an empty magazine MG after supplying all electronic deviceconveying media 10 carried in the magazine MG by the conveying means 401of the loader section LD in the pre-test electronic device stocker 801is moved from the supply position LS2 of the electronic device conveyingmedium 10 to loader section LD to a supply position US1 of theelectronic device conveying medium 10 from the unloader section UL inthe post-test electronic device stocker 802 and used as it is in thepost-test electronic device stocker 802. Namely, the magazine MG iscontinuously used from the pre-test electronic device stocker 801 to thepost-test electronic device stocker 802.

The post-test electronic device stocker 802 comprises the supplyposition US1 of the electronic device conveying medium 10 from theunloader section UL; a not shown conveying means in the X-axis directionfor storing a plurality of magazines MG and successively moving to adischarge position US2 of magazines MG to the next step; the dischargeposition US2 of the magazine MG to the next step; and a not shownposition control means in the Z-axis direction positioned at themagazines MG discharge position US2 to the next step for assistingcarriage from the unloader section UL.

In the post-test electronic device stocker 802, an electronic deviceconveying medium 10 loaded with post-test electronic device 20 is loadedone at a time on an empty magazine MG moved from the pre-test electronicdevice stocker 801 by a third conveying means 403 of the unloadersection UL at the supply position US1 of the electronic device conveyingmedia 10 from the unloader section UL.

At this time, in the supply position US1 of the electronic deviceconveying medium 10 from the unloader section UL, for example, loadingstarts from the bottom of the magazine MG, so that an electronic deviceconveying medium 10 loaded with post-test electronic devices 20 to beloaded next positions on top of the electronic device conveying media 10loaded with post-test electronic devices 20 already loaded in themagazine MG. It is configured that every time one electronic deviceconveying medium 10 loaded with post-test electronic devices 20 isloaded, a not shown Z-axis actuator lowers the magazine MG in the Z-axisdirection at a certain pitch, so that a position the next electronicdevice conveying medium 10 loaded with post-test electronic devices 20should be loaded can be always kept at the same height, and loading ofelectronic device conveying media 10 loaded with post-test electronicdevices 20 to the magazine MG by the third conveying means 403 of theunloader section UL is assisted.

A certain number of electronic device conveying media 10 loaded withpost-test electronic devices 20 are loaded in one magazine MG.Furthermore, a magazine MG loaded with the certain number of electronicdevice conveying media 10 loaded with post-test electronic devices 20 issuccessively moved close to the discharge position US2 of the magazineMG to the next step by being moved by the not shown conveying means inthe X-axis direction, and a plurality of the supplied magazines MG arestored on the not shown conveying means in the X-axis direction (in FIG.1, for example, 6 magazines MG are stored). A magazine MG reached at themagazine discharge position US2 is discharged in the next step.

Also, the above pre-test electronic device stocker 801 is provided witha retest electronic device stocker 803, and the retest electronic devicestocker 803 is provided with an empty magazines MG. An electronic deviceconveying medium 10 loaded with an electronic device 20 judged to berequiring a retest in the test is loaded to the empty magazine MG from alater explained first electronic device conveying medium carrier CR1 ora second electronic device conveying medium carrier CR2 by the thirdconveying means 403.

At this time, in the retest electronic device stocker 803, for example,loading starts from the bottom of the magazine MG, so that an electronicdevice conveying medium 10 loaded with an electronic device 20 judged tobe requiring a retest to be loaded next always positions on top ofelectronic device conveying media 10 loaded with an electronic device 20judged to be requiring a retest already loaded in the magazine MG. It isconfigured that every time an electronic device conveying medium 10loaded with an electronic device 20 judged to be requiring a retest isloaded, a not shown Z-axis actuator lowers the magazine MG to the Z-axisdirection at a certain pitch, so that a position the next electronicdevice conveying medium 10 loaded with an electronic device 20 judged tobe requiring a retest should position can be always kept at the sameheight. It assists loading of electronic device conveying media 10loaded with an electronic device 20 judged to be requiring a retest tothe magazine MG by the third conveying means 403 of the unloader sectionUL.

The magazine MG carrying the electronic device conveying medium 10loaded with an electronic device 20 judged to be requiring a retest inthe retest electronic device stocker 803 is again supplied to themagazine supply position LS1 from the previous step in the pre-testelectronic device stocker 801.

Loader Section LD

The loader section LD comprises a first conveying means 401 for takingout an electronic device conveying medium 10 loaded with pre-testelectronic devices 20 from the pre-test electronic device stocker 801and supplying to the chamber section 900.

The first conveying means 401 is, for example, a means capable of movinggrip heads for gripping one electronic device conveying medium 10 andmoving the gripped electronic device conveying medium 10 in the X-Y-Zaxes directions.

Among electronic device conveying media 10 loaded with pre-testelectronic device 20 carried in a magazine MG reached at the supplyposition LS2 of electronic device conveying medium 10 to the loadersection LD in the pre-test electronic device stocker 801, an electronicdevice conveying medium 10 loaded with pre-test electronic devices 20positioned on top is gripped by the first conveying means 401 and movedto a buffer portion 901 in a constant chamber.

Chamber Section 900

The chamber section 900 comprises a constant chamber for giving athermal stress of a high temperature or a low temperature to anelectronic device conveying medium 10 loaded with electronic devices tobe tested 20 for testing; a buffer portion 901 for securing time forapplying the thermal stress to the electronic device conveying medium 10loaded with electronic devices to be tested 20 supplied from the loadersection LD; a second conveying means 402 for moving the electronicdevice conveying medium 10 loaded with electronic devices to be tested20 in a state of being applied a thermal stress in the buffer portion901 by the constant chamber to a first electronic device conveyingmedium carrier CR1 or a second electronic device conveying mediumcarrier CR2; a first electronic device conveying medium carrier CR1 anda second electronic device conveying medium carrier CR2 for aligning aposition of one or more electronic device conveying medium 10 loadedwith electronic devices to be tested 20 and moving the electronic deviceconveying medium 10 to the test head portion 100, and a test headportion for conducting a test.

The constant chamber is configured to cover all of the above bufferportion 901, the second conveying means 402, the first electronic deviceconveying medium carrier CR1 and second electronic device conveyingmedium carrier CR2, and the test head portion 100 for applying andmaintaining a thermal stress of a high temperature or a low temperatureto electronic devices to be tested 20 loaded on the electronic deviceconveying medium 10.

Also, when applying a thermal stress of a high temperature or a lowtemperature to electronic devices to be tested 20, a certain time isnecessary, so that the buffer portion 901 is provided for securing thetime when applying a thermal stress to inside the constant chamber. Asshown in FIG. 1, the buffer portion 901 is configured that a certainnumber of electronic device conveying media 10 (nine electronic deviceconveying media 10 at a time in FIG. 1) can be arranged, so that thethermal stress can be applied to a plurality of electronic deviceconveying media 10 at a time.

The electronic device conveying medium 10 loaded with electronic devicesto be tested 20 sufficiently applied with a thermal stress in the bufferportion 901 is moved to the first electronic device conveying mediumcarrier CR1 or the second electronic device conveying medium carrier CR2by the second conveying means 402.

The second conveying means 402 is, for example, a means capable ofmoving grip heads for gripping one or more electronic device conveyingmedium 10 loaded with pre-test electronic devices 20 or one or moreelectronic device conveying medium 10 loaded with post-test electronicdevices 20 and moving the gripped electronic device conveying medium 10in the X-Y-Z axes directions.

Note that operation ranges of the first conveying means 401, the secondconveying means 402 and the third conveying means 403 partially overlapto one another, but interference of operations of mutual conveying meanscan be prevented by configuring that heights of rails and movable armsin the X-axis and Y-axis directions differ from one another and,furthermore, by controlling.

The first electronic device conveying medium carrier CR1 is, forexample, a conveying means capable of moving back and forth in theY-axis direction from an operation range of the third conveying means403 to above a first camera CM1 in an operation range of the firstmoving device 201 while keeping the posture of the electronic deviceconveying medium 10.

Also, an upper surface of the first electronic device conveying mediumcarrier CR1 has, for example, a configuration of a concave portion alongan outline of a plurality of the electronic device conveying media 10able to be gripped by the first moving device 201, and a circumferenceof the concave portion has a shape surrounded by inclined planes. Thus,when an electronic device conveying medium 10 loaded with electronicdevices to be tested 20 gripped by grip heads of the second conveyingmeans 402 is dropped into the concave portion, the dropping position ofthe electronic device conveying medium 10 is corrected on the inclinedplanes. Consequently, mutual positions of the plurality of electronicdevice conveying media 10 (two electronic device conveying media 10 inFIG. 1) are correctly aligned, and the electronic device conveying media10 whose positions are corrected can be matched accurately in pitches ofa plurality of grip heads 201 d of the first moving device 201.

The first electronic device conveying medium carrier CR1 alignspositions of the plurality of electronic device conveying media 10 inorder to supply the electronic device conveying media 10 loaded withpre-test electronic devices 20 conveyed as far as the buffer portion 901by one at a time to the first moving device 201 by many at a time and,furthermore, moves to a position above the first camera CM1 in theoperation range of the first moving device 201.

Furthermore, after the first electronic device conveying medium carrierCR1 moves to above the first camera CM1, an instruction of operationstart is sent to the first moving device 201 when the first camera CM1recognizes an existence of the electronic device conveying media 10.

The second electronic device conveying medium carrier CR2 is, forexample, a conveying means capable of moving back and forth in theY-axis direction from an operation range of the third conveying means403 to above a second camera CM2 in an operation range of the secondmoving device 202 while keeping the posture of the electronic deviceconveying medium 10.

Also, an upper surface of the second electronic device conveying mediumcarrier CR2 has, for example, a configuration of a concave portion alongan outline of a plurality of the electronic device conveying media 10able to be gripped by the second moving device 202, and a circumferenceof the concave portion has a shape surrounded by inclined planes. Thus,when an electronic device conveying medium 10 loaded with electronicdevices to be tested 20 gripped by grip heads of the second conveyingmeans 402 is dropped into the concave portion, the dropping position ofthe electronic device conveying medium 10 is corrected on the inclinedplanes. Consequently, mutual positions of the plurality of electronicdevice conveying media 10 (two electronic device conveying media 10 inFIG. 1) are correctly aligned, and the electronic device conveying media10 whose positions are corrected can be matched accurately in pitches ofa plurality of grip heads 202 d of the second moving device 202.

The second electronic device conveying medium carrier CR2 alignspositions of the plurality of electronic device conveying media 10 inorder to supply the electronic device conveying media 10 loaded withpre-test electronic devices 20 conveyed as far as the buffer portion 901by one at a time to the second moving device 202 by many at a time and,furthermore, moves to a position above the second camera CM2 in theoperation range of the second moving device 202.

Furthermore, after the second electronic device conveying medium carrierCR2 moves to above the second camera CM2, an instruction of operationstart is sent to the second moving device 202 when the second camera CM2recognizes an existence of the electronic device conveying media 10.

The electronic device conveying medium 10 loaded with electronic devices20 tested in by the test head portion 100 is reloaded to the firstelectronic device conveying medium carrier CR1 above the first cameraCM1 by the first moving device 201 and moved to an operation range ofthe third conveying means 403.

In the same way, the electronic device conveying medium 10 loaded withelectronic devices 20 tested by the test head portion 100 is reloaded tothe second electronic device conveying medium carrier CR2 above thesecond camera CM2 by the second moving device 202 and moved to anoperation range of the third conveying means 403.

When the electronic devices to be tested 20 loaded on the electronicdevice conveying medium 10 are made to be a high temperature, theelectronic devices to be tested 20 are cooled to the room temperature byblowing air in a state of being carried on the first electronic deviceconveying medium carrier CR1 or second electronic device conveyingmedium carrier CR2 while loaded on the electronic device conveyingmedium 10; while when made to be a low temperature, the electronicdevices to be tested 20 are heated by blowing hot air or a heater toreturn to a temperature of a degree of not causing dew condensationwhile loaded on the electronic device conveying medium 10. Theelectronic device conveying medium 10 loaded with the temperatureadjusted electronic devices to be tested 20 is conveyed out to theunloader section UL.

Note that although the respective moving devices 201 and 202 are capableof freely determine the number of electronic device conveying media 10able to be gripped independently from other moving devices and thegripping number within the number, the number of electronic deviceconveying media 10 able to be gripped by the first moving device 201 andthe number of electronic device conveying media 10 able to be carried bythe first electronic device conveying medium carrier CR1 are not alwaysmatched, or the number of electronic device conveying media 10 able tobe gripped by the second moving device 202 and the number of electronicdevice conveying media 10 able to be carried by the second electronicdevice conveying medium carrier CR2 are not always matched. For example,there is considered a method of making the index time short by makingthe number of electronic device conveying media 10 able to be carried onthe first electronic device conveying medium carrier CR1 to be two timesas much as the number of electronic device conveying media 10 able to begripped by the first moving device 201. Namely, there is considered amethod of making the index time short as a result that during the firstmoving device 201 conducts a test, the first electronic device conveyingmedium carrier CR1 returns to the operation range of the third conveyingmeans 403, the next electronic device conveying medium 10 loaded withpre-test electronic devices 20 is received from the buffer portion 901via the third conveying means 403 and moved to above the first cameraCM1 in the operation range of the first moving device 201, theelectronic device conveying medium 10 loaded with post-test electronicdevices 20 is received, and the next electronic device conveying medium10 loaded with pre-test electronic devices 20 is immediately supplied.

Note that the test head portion 100 will be explained in detail lateron.

Unloader Section UL

The unloader section UL comprises a third conveying means 403 forconveying an electronic device conveying medium 10 loaded with post-testelectronic devices 20 from the first electronic device conveying mediumcarrier CR1 or the second electronic device conveying medium carrier CR2to the post-test electronic device stocker 802 or the retest electronicdevice stocker 803 in an electronic device storing portion 800.

The third conveying means 403 is, for example, a means capable of movinggrip heads for gripping one electronic device conveying medium 10 andmoving the gripped electronic device conveying medium 10 in the X-Y-Zaxes directions.

The electronic device conveying medium 10 loaded with post-testelectronic devices 20 is moved from the first electronic deviceconveying medium carrier CR1 or second electronic device conveyingmedium carrier CR2 on the operation range of the third conveying means403 to the supply position US1 of the electronic device conveying medium10 from the unloader section UL in the post-test electronic devicestocker 802 by the third conveying means 403, and the electronic deviceconveying medium 10 is loaded in a magazine MG at the supply positionUS1 of the electronic device conveying medium 10 from the unloadersection UL.

Also, when an electronic device on the electronic device conveyingmedium 10 is judged to be requiring a retest by the test, the electronicdevice conveying medium 10 is loaded in the magazine MG in the retestelectronic device stocker 803 of the electronic device storing portion800 by the third conveying means from the first electronic deviceconveying medium carrier CR1 or the second electronic device conveyingmedium carrier CR2 on the operation range of the third conveying means403.

Test Head Portion 100

The electronic device conveying medium 10 is supplied to the test headportion 100 by the first electronic device conveying medium carrier CR1or second electronic device conveying medium carrier CR2, and a test isconducted while the electronic devices to be tested 20 are loaded on theelectronic device conveying medium 10.

The test head portion 100 comprises four contact groups, that is a firstcontact group 111, second contact group 112, third contact group 113 anda fourth contact group 114, for conducting a test on pre-test electronicdevices 20 arranged on an electronic device conveying medium 10 suppliedby the first electronic device conveying medium carrier CR1 or secondelectronic device conveying medium carrier CR2; a first moving device201 for controlling a position and posture of an electronic deviceconveying medium 10 loaded with electronic devices to be tested 20 in afirst range 301 covering above the first contact group 111 and above thesecond contact group 112 and a range including a first electronic deviceconveying medium carrier CR1 above the first camera CM1; and a secondmoving device 202 for controlling a position and posture of electronicdevice conveying medium 10 loaded with electronic devices to be tested20 in a second range 302 covering above the third contact group 113 andthe fourth contact group 114 and a range including the second electronicdevice conveying medium carrier CR2 above the second camera CM2.

The first moving device 201 is a means for controlling positions of aplurality of electronic device conveying media 10 (two electronic deviceconveying media in FIG. 1) in the X-Y-Z axes directions and controllinga posture in the θ-angle direction by using the Z-axis as a center axis.For example, it is configured to be able to move in the first range 301above the first contact group 111 and the second contact group 112 and arange including above the first electronic device conveying mediumcarrier CR1 above the first camera CM1 by a rail 201 a provided alongthe X-axis direction, a movable arm 201 b moving on the rail 201 a inthe X-axis direction, and a movable head 201 c supported by the movablearm 201 b and capable of moving along the movable arm 201 b in theY-axis direction.

The movable head 201 c is also movable in the Z-axis direction (that is,in the vertical direction) by a not shown Z-axis actuator and,furthermore, controllable in the θ-angle direction by using the Z-axisas a center axis by a not shown posture control function. It is possibleto grip, convey and release a plurality of electronic device conveyingmedia 10 (two in the case in FIG. 1) at a time by a plurality of gripheads 201 d (for example, 8 suction heads) provided to the movable head201 c.

One electronic device to be tested 20 on the electronic device conveyingmedium 10 corresponds to one contact 110 a, and respective electronicdevices to be tested 20 loaded on an electronic device conveying medium10 gripped by grip heads 201 d are applied a suitable pressure by anoperation of the movable head 201 c in the downward Z-axis direction andmade to contact not shown contact pins on the contact 110 a, so that atest is conducted. The test result is, for example, stored at an addressdetermined by an identification number attached to an electronic deviceconveying medium 10 and an electronic device number assigned inside theelectronic device conveying medium 10.

The first contact group 111 is composed of a set of contact portions 110a for conducting a test on electronic devices 20, and the second contactgroup 112, third contact group 0.113 and fourth contact group 114 arecomposed of sets of contact portions 110 a in the same way.

As far as the number of contact portions 110 a in total in an electronicdevice testing apparatus 1 matches with the simultaneously measurednumber limited in the electronic device testing apparatus 1 (Normally,the number of test positions able to be measured at a time, that is thesimultaneously measured number, is limited to 2^(n), such as 32 or 64,per one electronic device testing apparatus 1. Note that “n” is anatural number), it is possible to determine optimal number andarrangement of contact portions 110 a in the respective contact groups111, 112, 113 and 114 in accordance with the number and arrangement ofelectronic devices to be tested 20 on the electronic device conveyingmedium 10 and a production plan, etc. Namely, as far as the total numberof contact portions 110 a of the first contact group 111, second contactgroup 112, third contact group 113 and fourth contact group 114 matcheswith the simultaneously measured number of 32 or 64 limited in theelectronic device testing apparatus 1, the number of contact portions110 a in the respective contact groups 110 can be freely set.

Also, pitches between the respective contact portions 110 a in thecontact groups 111, 112, 113 and 114 have relationship of beingidentical with multiples of pitches (including 1) between respectiveelectronic devices 20 arranged on electronic device conveying medium 10corresponding to the respective contact groups 111, 112, 113 and 114.

Furthermore, as shown in FIG. 4, FIG. 7, FIG. 10, FIG. 13 and FIG. 16,the number of contact groups 110 in the electronic device testingapparatus 1 may be provided to be an optimal number in accordance withthe number and arrangement of electronic devices to be tested 20 on anelectronic device conveying medium 10 and a production plan, etc. Bymutually independently providing by making the first moving device 201correspond to the first contact group 111 and the second contact group112, and the second moving device 202 to the third contact group 113 andfourth contact group 114; two contact groups, that is the first contactgroup 111 and the second contact group 112, and two contact groups, thatis the third contact group 113 and the fourth contact group 114, arecapable of operating independently from one another.

Also, by holding a plurality of electronic device conveying media 10(two in the case in FIG. 1) by one moving device, facility costs and theoccupying area can be suppressed and the simultaneously measured numbercan be secured while making the number of moving devices on the testhead portion 100 as less as possible.

As to the basic configuration and operation of the second moving device202, it is a means for controlling positions of a plurality ofelectronic device conveying media 10 in the X-Y-Z axes directions andcontrolling a posture in the θ-angle direction using the Z-axis as acenter axis in the same way as the above first moving device 201 and,for example, configured to be able to move in a second range 302 abovethe third contact group 113 and the fourth contact group 114 and a rangeincluding above the second electronic device conveying medium carrierCR2 above the second camera CM2 due to a rail 202 a provided along theX-axis direction, a movable arm 202 b moving on the rail 202 a in theX-axis direction, and a movable head 202 c supported by the movable arm202 b and movable along the movable arm 202 b in the Y-axis direction.

The movable head 202 c is movable in the Z-axis direction (that is, inthe vertical direction) by a not shown Z-axis actuator and, furthermore,control of the θ-angle by using the Z-axis as a center axis is alsopossible by a not shown posture control function. Also, a plurality ofelectronic device conveying media 10 (two in the case in FIG. 1) can begripped, conveyed and released at a time by a plurality of grip heads202 d (for example, 8 suction heads) provided to the movable head 202 c.

On an upper portion of FIG. 2 shows an outline of a control system ofthe electronic device testing apparatus 1, and the control systemcomprises a main controller MC, a first sub controller SC1, and a secondsub controller SC2.

The main controller MC collectively manages the first sub controller SC1and the second sub controller SC2 to perform control in the Z-axisdirection for tests on the first moving device 201, control in theZ-axis direction for tests on the second moving device 202, and controlof outputting a start request signal to the first contact group 111, thesecond contact group 112, the third contact group 113 and the fourthcontact group 114. As a result, test timings in the first contact group111, the second contact group 112, the third contact group 113 and thefourth contact group 114 can be synchronized, and the simultaneouslymeasured number can be secured.

Furthermore, the first sub controller SC1 performs control relating tomoving in the X-Y-Z directions and a posture in the θ-angle direction ofthe first moving device 201 excepting for those performed by the maincontroller MC, the second sub controller SC2 performs control of movingin the X-Y-Z directions and a posture in the θ-angle direction of thesecond moving device 202 excepting for those performed by the maincontroller MC. Consequently, the three moving devices can be controlledindependently from one another.

In the above example, the explanation was made in premise that there arefour contact groups 110 and two moving devices, and the two movingdevices 201 and 202 can respectively grip two electronic deviceconveying media 10. But it is not limited to these, the number ofcontact groups 110 (for example, one to three contact groups 110 or fiveor more contact groups 110) and the number and arrangement of contactportions 110 a in each contact group 110 can be optimally determined inaccordance with the number and arrangement of electronic devices to betested 20 on the electronic device conveying medium 10 and a productionplan, etc. Also, the number of the mutually independent moving devices(for example, one moving device or three or more moving devices), acontact group 110 corresponding to each moving device, the number ofelectronic device conveying media 10 able to be gripped by each movingdevice (for example, a moving device capable of gripping one or three ormore electronic device conveying media 10), the number of electronicdevice conveying media 10 gripped freely and independently from othermoving devices within the number able to be gripped by the respectivemoving devices can be optimally set for each moving device.

Note that when the number of contact groups 110 increases, the occupyingarea of the facility increases, while when the number of the contactgroups 110 is decreased, the simultaneously measured number becomes hardto be secured.

Also, when the number of moving devices increases, the facility constand occupying area increase, and when the number of electronic deviceconveying media 10 able to be gripped by one moving device increases, itis hard to obtain positional accuracy. Accordingly, it is necessary tocompare and consider the occupying area, facility costs and alignmentaccuracy, etc. to determine the optimal number of contact groups 110,the number and arrangement of contact portions 110 a in the contactgroup 110, the number of mutually independent moving devices, a contactgroup 110 corresponding to each moving device, the number of electronicdevice conveying media able to be gripped by one moving device, and thenumber of electronic device conveying media 10 freely gripped by eachmoving device within the number able to be gripped independently fromother moving devices in accordance with the number and arrangement ofelectronic devices to be tested 20 on an electronic device conveyingmedium 10 and a production plan, etc.

Next, an operation will be explained.

The test head portion 100 of the electronic device testing apparatus 1comprises the first moving device 201 capable of moving in a first range301 covering above the first contact group 111 and the second contactgroup 112 and a range including above the first electronic deviceconveying medium carrier CR1 above the first camera CM1, and the secondmoving device 202 movable in a second range 302 covering above the thirdcontact groups 113 and the fourth contact group 114 and a rangeincluding above the second electronic device conveying medium carrierCR2 above the second camera CM2. The number of electronic deviceconveying media 10 able to be gripped is 2 in each of the moving devices201 and 202.

Also, the electronic device conveying medium 10 loaded with pre-testelectronic devices 20 aligned and supplied by the first electronicdevice conveying medium carrier CR1 is tested at the first contact group111 and the second contact group 112 by the first moving device 201.

Also, the electronic device conveying medium 10 loaded with pre-testelectronic devices 20 aligned and supplied by the second electronicdevice conveying medium carrier CR2 is tested at the third contact group113 and the fourth contact group 114 by the second moving device 202.

Below, a testing method capable of flexibly dealing by freely combiningthe gripping number of electronic device conveying media according tocircumstances within the number able to be gripped by the respectivemoving devices in the case of using the electronic device testingapparatus 1 particularly when the simultaneously measured number of thetest head portion is 32, namely, each of specific testing methods in thecase where the electronic device conveying medium 10 is one, the case oftwo, another example in the case of two, the case of three and the caseof four will be explained.

Note that below, an electronic device conveying medium 11 indicates anelectronic device conveying medium arranged with 32 electronic devicesto be tested 20 in four rows by eight columns to be subjected to a testat the first contact group 111, an electronic device conveying medium 12indicates an electronic device conveying medium arranged with 32electronic devices to be tested 20 in four rows by eight columns to besubjected to a test at the second contact group 112, an electronicdevice conveying medium 13 indicates an electronic device conveyingmedium arranged with 32 electronic devices to be tested 20 in four rowsby eight columns to be subjected to a test at the third contact group113, and an electronic device conveying medium 14 indicates anelectronic device conveying medium arranged with electronic devices tobe tested 20 in four rows by eight columns to be subjected to a test atthe fourth contact group 114.

FIG. 3 shows corresponding relationship of an electronic deviceconveying medium 11 and the respective contact groups 111, 112, 113 and114 in the case of one electronic device conveying medium 11 loaded withelectronic device to be tested 20. In this case, one electronic deviceconveying medium 11 is gripped by the first moving device 201 havinggrip heads 201 d capable of gripping two electronic device conveyingmedia 11 and 12. Accordingly, the first electronic device conveyingmedium carrier CR1 does not supply the electronic device conveyingmedium 12 to the first moving device 201, and the second electronicdevice conveying medium carrier CR2 does not supply the electronicdevice conveying media 13 and 14 to the second moving device 202.

FIG. 4 shows an arrangement of the contact group 110 in the case of thesimultaneously measured number of 32 corresponding to FIG. 3, whereinthe number of contact portions 110 a in the first contact group 111 isset to be 32 (four rows by eight columns), and the numbers of thecontact portions 110 a in the second contact group 112, the thirdcontact group 113 and the fourth contact group 114 are all set to bezero for the four contact groups 111, 112, 113 and 114.

FIG. 5 shows the test positions 21 in the first round (The testpositions 21 in the first round indicates all black squares in thefigure. It is the same in FIG. 8, FIG. 11, FIG. 14, FIG. 17 and FIG. 20)of an arrangement of electronic devices to be tested 20 on an electronicdevice conveying medium 11 corresponding to FIG. 4, wherein the firstelectronic device conveying medium 11 loaded with electronic devices 20to be tested at the first contact group 111. Note that since the numberof contact portions 110 a is set to be zero in all of the second contactgroup 112, third contact group 113 and fourth contact group 114, theelectronic device conveying media 12, 13 and 14 to be objects thereofare not shown in FIG. 5.

The first electronic device conveying medium 11 aligned and supplied bythe first electronic device conveying medium carrier CR1 is moved to arange above the first contact group 111 by the first moving device 201.

Next, the first moving device 201 moves electronic devices to be tested20 on the first electronic device conveying medium 11 in FIG. 5 in arange from first row on the first column to the eighth row on the fourthcolumn of the arrangement to above the first contact group 111.

Next, the first moving device 201 conducts a test in the first round on32 electronic devices 20 in a range from the first row on the firstcolumn to the eighth row on the fourth column in an arrangement on theelectronic device conveying medium 11, and the test is conducted for onetime in total on one electronic device conveying medium 11.

After completing the test for one time in total, the post-tested firstelectronic device conveying medium 11 which comes first is discharged tothe post-test electronic device stocker 802 or the retest electronicdevice stocker 803 by the first electronic device conveying mediumcarrier CR1 via the third conveying means 403 of the unloader sectionUL, and the next electronic device conveying medium 11 is supplied tothe first moving device 201 by the first electronic device conveyingmedium carrier CR1.

As explained above, by securing the simultaneously measured number of 32in the first contact group 111, and setting the number of contactportions 110 a to zero in all of the second contact group 112, the thirdcontact group 113 and the fourth contact group 114, the simultaneouslymeasured number of 32 limited in the electronic device testing apparatus1 can be always secured and a high testing efficiency can be realized.

FIG. 6 shows corresponding relationship of an electronic deviceconveying media 11 and 12 and the respective contact groups 111, 112,113 and 114 in the case of two electronic device conveying media 11 and12 loaded with electronic device to be tested 20. In this case, twoelectronic device conveying media 11 and 12 are gripped by the firstmoving device 201 having grip heads 201 d capable of gripping twoelectronic device conveying media 11 and 12. Accordingly, the secondelectronic device conveying medium carrier CR2 does not supply theelectronic device conveying media 13 and 14 to the second moving device202.

FIG. 7 shows an arrangement of the contact group 110 in the case of thesimultaneously measured number of 32 corresponding to FIG. 6, whereinthe number of contact portions 110 a in the first contact group 111 isset to be 16 (four rows by four columns), the numbers of the contactportions 110 a in the second contact group 112 is also set to be 16(four rows by four columns), and the number of contact portions 110 a ofthe third contact group 113 and the fourth contact group 114 are set tobe zero for the four contact groups 111, 112, 113 and 114.

FIG. 8 shows the test positions 21 in the first round of an arrangementof electronic devices to be tested 20 on an electronic device conveyingmedia 11 and 12 corresponding to FIG. 7, wherein the first electronicdevice conveying medium 11 loaded with electronic devices 20 to betested at the first contact group 111, and the second electronic deviceconveying medium 12 loaded with electronic devices 20 to be tested atthe second contact group 112 are shown. Note that since the number ofcontact portions 110 a is set to zero in both of the third contact group113 and fourth contact group 114, the electronic device conveying media13 and 14 to be objects thereof are not shown in FIG. 8.

Two electronic device conveying media, that is the first electronicdevice conveying medium 11 and the second electronic device conveyingmedium 12, aligned and supplied by the first electronic device conveyingmedium carrier CR1 are gripped by the grip heads 201 d of the firstmoving device 201 at a time and moved to the first range 301 above thefirst contact group 111 and the second contact group 112 by the firstmoving device 201.

Next, the first moving device 201 moves electronic devices to be tested20 on the first electronic device conveying medium 11 in FIG. 8 in arange from first row on the first column to the fourth row on the fourthcolumn of the arrangement to above the first contact group 111, andelectronic devices to be tested 20 on the second electronic deviceconveying medium 12 in a range from first row on the first column to thefourth row on the fourth column of the arrangement are moved to abovethe second contact group 112 together at a time.

Next, the first moving device 201 conducts a test in the first round on16 electronic devices 20 in a range from the first row on the firstcolumn to the fourth row on the fourth column in an arrangement of thefirst electronic device conveying medium 11, and 16 electronic devices20 in a range from the first-row on the first column to the fourth rowon the fourth column in an arrangement of the second electronic deviceconveying medium 12, and the test in the first round is conductedtogether at a time.

After the test finishes, the movable head 201 c having grip heads 201 dholding the first electronic device conveying medium 11 and the secondelectronic device conveying medium 12 is elevated, then, moved to theY-axis direction by an amount of four rows by the first moving device201.

Next, the first moving device 201 conducts a test in the second round on16 electronic devices 20 in a range from the fifth row on the firstcolumn to the eighth row on the fourth column of the arrangement on thefirst electronic device conveying medium 11, and 16 electronic devices20 in a range from the fifth row on the first column to the eighth rowon the fourth column of the arrangement on the second electronic deviceconveying medium 12 together at a time, and tests are conducted for twotimes in total.

After completing the test for two times in total, the post-tested firstelectronic device conveying medium 11 which comes first and thepost-tested electronic device conveying medium 12 which comes first aredischarged to the post-test electronic device stocker 802 or the retestelectronic device stocker 803 by the first electronic device conveyingmedium carrier CR1 via the third conveying means 403 of the unloadersection UL, and the next electronic device conveying media 11 and 12 aresupplied to the first moving device 201 by the first electronic deviceconveying medium carrier CR1.

Accordingly, tests are conducted for two times in total on one of firstelectronic device conveying media 11 and one of second electronic deviceconveying media 12, and tests on one of second electronic deviceconveying media 12 can be finished before the tests on one of firstelectronic device conveying media 11 finishes.

As explained above, by securing 16 test positions on the first contactgroup 111 and 16 test positions also on the second contact group 112,the simultaneously measured number of 32 limited in the electronicdevice testing apparatus 1 can be always secured and a high testingefficiency can be realized.

Note that, as shown in FIG. 7, when applying an arrangement of contactportion 110 a as in the first contact group 111 and the second contactgroup 112 to an electronic device conveying medium having a pointsymmetry arrangement about the Z-axis as in the electronic deviceconveying media 11 and 12, a moving method below being different fromthat explained above is considered.

Two electronic device conveying media, that is the first electronicdevice conveying medium 11 and the second electronic device conveyingmedium 12, aligned and supplied by the first electronic device conveyingmedium carrier CR1 are gripped by grip heads 201 d of the first movingdevice 201 at a time and moved to the first range 301 above the firstcontact group 111 and the second contact group 112 by the first movingdevice 201.

Next, the first moving device 201 moves electronic devices to be tested20 on the first electronic device conveying medium 11 in FIG. 8 in arange from first row on the first column to the fourth row on the fourthcolumn of the arrangement to above the first contact group 111, andelectronic devices to be tested 20 on the second electronic deviceconveying medium 12 in a range from first row on the first column to thefourth row on the fourth column of the arrangement are moved to abovethe second contact group 112 together at a time.

Next, the first moving device 201 conducts a test in the first round on16 electronic devices 20 in a range from the first row on the firstcolumn to the fourth row on the fourth column in an arrangement on thefirst electronic device conveying medium 11, and 16 electronic devices20 in a range from the first row on the first column to the fourth rowon the fourth column in an arrangement on the second electronic deviceconveying medium 12, and the test in the first round is conductedtogether at a time.

After completing the test, the movable head 201 c having grip heads 201d holding the first electronic device conveying medium 11 and the secondelectronic device conveying medium 12 is elevated, then, rotated to theθ-angle direction by 180 degree about the Z-axis by the first movingdevice 201.

Next, a method of conducting a test in the second round by the firstmoving device 201 on 16 electronic devices 20 in a range from the fifthrow on the first column to the eighth row on the fourth column of thearrangement on the first electronic device conveying medium 11 and 16electronic devices 20 in a range from the fifth row on the first columnto the eighth row on the fourth column of the arrangement on the secondelectronic device conveying medium 12 together at a time.

FIG. 9 shows corresponding relationship of electronic device conveyingmedia 12 and 13 and the respective contact groups 111, 112, 113 and 114in another example in the case of two electronic device conveying media12 and 13 loaded with electronic device to be tested 20. In this case,one electronic device conveying medium 12 is gripped by the first movingdevice 201 having grip heads 201 d capable of gripping two electronicdevice conveying media 11 and 12, and one electronic device conveyingmedium 13 is gripped by the second moving device 202 having grip heads202 d capable of gripping two electronic device conveying media 13 and14 at a time. Accordingly, the first electronic device conveying mediumcarrier CR1 does not supply the electronic device conveying medium 11 tothe first moving device 201 and the second electronic device conveyingmedium carrier CR2 does not supply the electronic device conveyingmedium 14 to the second moving device 202.

FIG. 10 shows an arrangement of the contact group 110 in the case of thesimultaneously measured number of 32 corresponding to FIG. 9, whereinthe number of contact portions 110 a in the second contact group 112 isset to be 16 (four rows by four columns), the numbers of the contactportions 110 a in the third contact group 113 is also set to be 16 (fourrows by four columns), the number of contact portions 110 a in the firstcontact group 111 and the fourth contact group 114 are set to be zerofor the four contact groups 111, 112, 113 and 114.

FIG. 11 shows the test positions 21 in the first round of an arrangementof electronic devices to be tested 20 on the electronic device conveyingmedia 12 and 13 corresponding to FIG. 10, wherein the second electronicdevice conveying medium 12 loaded with electronic devices 20 to betested at the second contact group 112, and the third electronic deviceconveying medium 13 loaded with electronic devices 20 to be tested atthe third contact group 113 are shown. Note that since the number ofcontact portions 110 a is set to be zero in the first contact group 111and fourth contact group 114, the electronic device conveying media 11and 14 to be objects thereof are not shown in FIG. 11.

The electronic device conveying medium 12 aligned and supplied by thefirst electronic device conveying medium carrier CR1 is gripped by gripheads 201 d of the first moving device 201 and moved to the first range301 on the first contact group 111 and the second contact group 112 bythe first moving device 201.

Next, the first moving device 201 moves the electronic devices to betested 20 on the second electronic device conveying medium 12 in FIG. 11in a range from the first row on the first column to the fourth row onthe fourth column to above the second contact group 112.

Next, 16 electronic devices 20 in a range from the first row on thefirst column to the fourth row on the fourth column of an arrangement onthe second electronic device conveying medium 12 are tested in the firstround at the second contact group 112 by the first moving device 201.

When the test is finished, the movable head 201 c having grip heads 201d holding the second electronic device conveying medium 12 is elevatedby the first moving device 201, then, moved to the Y-axis direction byan amount of four rows.

Next, 16 electronic devices 20 in a range from the fifth row on thefirst column to the eighth row on the fourth column of an arrangement onthe second electronic device conveying medium 12 are tested in thesecond round at the second contact group 112 by the first moving device201, and tests are conducted for two times in total on one of secondelectronic device conveying media 12.

When the tests for two times in total are finished, the post-testedsecond electronic device conveying medium 12 which comes first isdischarged to the post-test electronic device stocker 802 or the retestelectronic device stocker 803 by the first electronic device conveyingmedium carrier CR1 via the third conveying means 403 of the unloadersection UL, and the next electronic device conveying medium 12 issupplied to the first moving device 201 by the first electronic deviceconveying medium carrier CR1.

The third electronic device conveying medium 13 aligned and supplied bythe second electronic device conveying medium carrier CR2 is gripped bygrip heads 202 d of the second moving device 202 and moved to the secondrange 302 above the third contact group 113 and the fourth contact group114 by the second moving device 202, and electronic devices to be tested20 in a range from the first row on the first column to the fourth rowon the fourth column of the arrangement on the third electronic deviceconveying medium 13 are moved to above the third contact group 113.

Next, 16 electronic devices 20 in a range from the first row on thefirst column to the fourth row on the fourth column of the arrangementon the third electronic device conveying medium 13 are tested in thefirst round at the third contact group 113 by the second moving device202.

When the test is finished, the movable head 202 c having grip heads 202d holding the third electronic device conveying medium 13 in the secondmoving device 202 is elevated, then, moved to the Y-axis direction by anamount of four rows.

Next, 16 electronic devices 20 in a range from the fifth row on thefirst column to the eighth row on the fourth column of an arrangement onthe third electronic device conveying medium 13 are tested in the secondround at the third contact group 113 by the second moving device 202,and test is conducted for two times in total on one of third electronicdevice conveying media 13.

When the tests for two times in total are finished, the post-testedthird electronic device conveying medium 13 which comes first isdischarged to the post-test electronic device stocker 802 or the retestelectronic device stocker 803 by the second electronic device conveyingmedium carrier CR2 via the third conveying means 403 of the unloadersection UL, and the next electronic device conveying medium 13 issupplied to the second moving device 202 by the second electronic deviceconveying medium carrier CR2.

Accordingly; the test is conducted for two times in total on one ofsecond electronic device conveying media 12 and one of third electronicdevice conveying media 13, and tests on one of third electronic deviceconveying media 13 can be finished before tests on one of secondelectronic device conveying media 12 finishes.

Note that test timing of the first moving device 201 and test timing ofthe second moving device 202 are synchronized by the main controller MCin the first moving device 201 and the second moving device 202, andtests are conducted at the same timing.

By controlling the two moving devices 201 and 202 independently by therespective sub controllers SC1 and SC2, securing 16 test positions inthe second contact group 112 and 16 test positions also in the thirdcontact group 113, the simultaneously measured number of 32 limited inthe electronic device testing apparatus 1 can be always secured and ahigh testing efficiency can be realized.

FIG. 12 shows corresponding relationship of electronic device conveyingmedia 11, 12 and 13 and the respective contact groups 111, 112, 113 and114 in an example in the case of three electronic device conveying media11, 12 and 13 loaded with electronic device to be tested 20.

In this case, two electronic device conveying media 11 and 12 aregripped by the moving device 201 having grip heads 201 d capable ofgripping two electronic device conveying media 11 and 12 at a time, andone electronic device conveying medium 13 is gripped by the movingdevice 202 having grip heads 202 d capable of gripping two electronicdevice conveying media 13 and 14 at a time. Accordingly, the secondelectronic device conveying medium carrier CR2 does not supply theelectronic device conveying medium 14 to the second moving device 202.

FIG. 13 shows an arrangement of the contact group 110 in the case of thesimultaneously measured number of 32 corresponding to FIG. 12, whereinthe number of contact portions 110 a in the first contact group 111 isset to be 8 (two rows by four columns), the number of contact portions110 a in the second contact group 112 is also set to be 8 (two rows byfour columns), the numbers of the contact portions 110 a in the thirdcontact group 113 is set to be 16 (four rows by four columns), and thenumber of contact portions 110 a in the fourth contact group 114 is setto be zero for the four contact groups 111, 112, 113 and 114.

FIG. 14 shows the test positions 21 in the first round of an arrangementof electronic devices to be tested 20 on the electronic device conveyingmedia 11, 12 and 13 corresponding to FIG. 13, wherein the firstelectronic device conveying medium 11 loaded with electronic devices 20to be tested at the first contact group 111, the second electronicdevice conveying medium 12 loaded with electronic devices 20 to betested at the second contact group 112, and the third electronic deviceconveying medium 13 loaded with electronic devices 20 to be tested atthe third contact group 113 are shown. Note that since the number ofcontact portions 110 a is set to be zero in the fourth contact group114, the electronic device conveying media 14 to be an object thereof isnot shown in FIG. 14.

The electronic device conveying medium 11 and the electronic deviceconveying medium 12 aligned and supplied by the first electronic deviceconveying medium carrier CR1 are gripped by grip heads 201 d of thefirst moving device 201 at a time and moved to the first range 301 abovethe first contact group 111 and the second contact group 112 by thefirst moving device 201.

Next, the first moving device 201 moves the electronic devices to betested 20 on the first electronic device conveying medium 11 in FIG. 14in a range from the first row on the first column to the second row onthe fourth column to above the first contact group 111, and theelectronic devices to be tested 20 on the second electronic deviceconveying medium 12 in a range from the first row on the first column tothe second row on the fourth column to above the second contact group112 together at a time.

Next, 8 electronic devices 20 in a range from the first row on the firstcolumn to the second row on the fourth column of an arrangement of thefirst electronic device conveying medium 11 is tested at the firstcontact group 111, and 8 electronic devices 20 in a range from the firstrow on the first column to the second row on the fourth column of anarrangement of the second electronic device conveying medium 12 istested at the second contact group 112 by the first moving device 201together at a time in the first round.

When the test is finished, the movable head 201 c having grip heads 201d holding two electronic device conveying media, that is the firstelectronic device conveying medium 11 and the second electronic deviceconveying medium 12, is elevated by the first moving device 201, then,moved to the Y-axis direction by an amount of two rows.

Next, 8 electronic devices 20 in a range from the third row on the firstcolumn to the fourth row on the fourth column of an arrangement on thefirst electronic device conveying medium 11 are tested at the firstcontact group 111, and 8 electronic devices 20 in a range from the thirdrow on the first column to the fourth row on the fourth column of anarrangement on the second electronic device conveying medium 12 aretested at the second contact group 112 together at a time in the secondround by the first moving device 201.

Below, 8 electronic devices 20 are tested in the same order, and testsare conducted for four times in total.

After the tests for four times are completed, the post-tested firstelectronic device conveying medium 11 which comes first and thepost-tested second electronic device conveying medium 12 which comesfirst are discharged to the post-test electronic device stocker 802 orthe retest electronic device stocker 803 by the first electronic deviceconveying medium carrier CR1 via the third conveying means 403 of theunloader section UL, and the next electronic device conveying media 11and 12 are supplied to the first moving device 201 by the firstelectronic device conveying medium carrier CR1.

The third electronic device conveying medium 13 aligned and supplied bythe second electronic device conveying medium carrier CR2 is gripped bygrip heads 202 d of the second moving device 202 and moved to the secondrange 302 above the third contact group 113 and the fourth contact group114 by the second moving device 202.

Next, electronic devices to be tested 20 in a range from the first rowon the first column to the fourth row on the fourth column of thearrangement on the third electronic device conveying medium 13 in FIG.14 are moved to above the third contact group 113.

Next, 16 electronic devices 20 in a range from the first row on thefirst column to the fourth row on the fourth column of the arrangementof the third electronic device conveying medium 13 are tested in thefirst round at the third contact group 113 by the second moving device202.

When the test is finished, the movable head 202 c having grip heads 202d holding the third electronic device conveying medium 13 is elevated bythe second moving device 202, then, moved to the Y-axis direction by anamount of four rows.

Next, 16 electronic devices 20 in a range from the fifth row on thefirst column to the eighth row on the fourth column w of an arrangementon the third electronic device conveying medium 13 are tested in thesecond round at the third contact group 113 by the second moving device202.

When the tests for two times in total are finished, the post-testedthird electronic device conveying medium 13 which comes first isdischarged to the post-test electronic device stocker 802 or the retestelectronic device stocker 803 by the second electronic device conveyingmedium carrier CR2 via the third conveying means 403 of the unloadersection UL, and the next third electronic device conveying medium 13 issupplied to the second moving device 202 by the second electronic deviceconveying medium carrier CR2.

Accordingly, the test is conducted for four times in total on one offirst electronic device conveying media 11 and one of second electronicdevice conveying media 12, and the test is conducted for two times intotal on one of third electronic device conveying media 13. Tests on twoof third electronic device conveying media 13 can be finished beforetests on one of first electronic device conveying media 11 and one ofsecond electronic device conveying media 12 finish.

Note that test timing of the first moving device 201 and test timing ofthe second moving device 202 are synchronized by the main controller MCin the first moving device 201 and the second moving device 202, andtests are conducted at the same timing. By controlling the two movingdevices 201 and 202 independently by the respective sub controllers SC1and SC2, and securing 8 test positions in the first contact group 111, 8test positions in the second contact group 112, and 16 test positionsalso in the third contact group 113, the simultaneously measured numberof 32 limited in the electronic device testing apparatus 1 can be alwayssecured and a high testing efficiency can be realized.

FIG. 15 shows a corresponding relationship of electronic deviceconveying media 11, 12, 13 and 14 and the respective contact groups 111,112, 113 and 114 in an example in the case of four electronic deviceconveying media 11, 12, 13 and 14 loaded with electronic device to betested 20. In this case, two electronic device conveying media 11 and 12are gripped by the first moving device 201 having grip heads 201 dcapable of gripping two electronic device conveying media 11 and 12 at atime, and two electronic device conveying media 13 and 14 are gripped bythe second moving device 202 having grip heads 202 d capable of grippingtwo electronic device conveying media 13 and 14 at a time.

FIG. 16 shows an arrangement of the contact group 110 in the case of thesimultaneously measured number of 32 corresponding to FIG. 15, whereinthe number of contact portions 110 a in the first contact group 111 isset to be 8 (two rows by four columns), the number of contact portions110 a in the second contact group 112 is also set to be 8 (two rows byfour columns), the numbers of the contact portions 110 a in the thirdcontact group 113 is set to be 8 (two rows by four columns), and thenumber of contact portions 110 a in the fourth contact group 114 is setto be 8 (two rows by four columns) for the four contact groups 111, 112,113 and 114.

FIG. 16 shows the test positions 21 in the first round of an arrangementof electronic devices to be tested 20 on the electronic device conveyingmedia 11, 12, 13 and 14 corresponding to FIG. 15, wherein the firstelectronic device conveying medium 11 loaded with electronic devices 20to be tested at the first contact group 111, the second electronicdevice conveying medium 12 loaded with electronic devices 20 to betested at the second contact group 112, the third electronic deviceconveying medium 13 loaded with electronic devices 20 to be tested atthe third contact group 113, and the fourth electronic device conveyingmedium 14 loaded with electronic devices 20 to be tested at the fourthcontact group 114 are shown.

The electronic device conveying medium 11 and the electronic deviceconveying medium 12 aligned and supplied by the first electronic deviceconveying medium carrier CR1 are gripped by grip heads 201 d of thefirst moving device 201 at a time and moved to the first range 301 abovethe first contact group 111 and the second contact group 112 by thefirst moving device 201.

Next, the first moving device 201 moves the electronic devices to betested 20 on the first electronic device conveying medium 11 in FIG. 17in a range from the first row on the first column to the second row onthe fourth column to above the first contact group 111, and theelectronic devices to be tested 20 on the second electronic deviceconveying medium 12 in a range from the first row on the first column tothe second row on the fourth column to above the second contact group112 together at a time.

Next, 8 electronic devices 20 in a range from the first row on the firstcolumn to the second row on the fourth column of an arrangement of thefirst electronic device conveying medium 11 are tested at the firstcontact group 111, and 8 electronic devices 20 in a range from the firstrow on the first column to the second row on the fourth column of anarrangement of the second electronic device conveying medium 12 aretested at the second contact group 112 by the first moving device 201together at a time in the first round.

When the test is finished, the movable head 201 c having grip heads 201d holding two electronic device conveying media, that is the firstelectronic device conveying medium 11 and the second electronic deviceconveying medium 12, is elevated by the first moving device 201, then,moved to the Y-axis direction by an amount of two rows.

Next, 8 electronic devices 20 in a range from the third row on the firstcolumn to the fourth row on the fourth column of an arrangement on thefirst electronic device conveying medium 11 are tested at the firstcontact group 111, and 8 electronic devices 20 in a range from the thirdrow on the first column to the fourth row on the fourth column of anarrangement on the second electronic device conveying medium 12 aretested at the second contact group 112 together at a time in the secondround by the first moving device 201.

When the tests are finished, the movable head 201 c having grip heads201 d holding two electronic device conveying media, that is the firstelectronic device conveying medium 11 and the second electronic deviceconveying medium 12, is elevated by the first moving device 201, then,moved to the Y-axis direction by an amount of two rows.

After that, the operation is repeated, and the test is conducted forfour times in total on the two electronic device conveying media 11 and12 by the first moving device 201.

After the tests for four times are completed, the post-tested firstelectronic device conveying medium 11 which comes first and thepost-tested second electronic device conveying medium 12 which comesfirst are discharged to the post-test electronic device stocker 802 orthe retest electronic device stocker 803 by the first electronic deviceconveying medium carrier CR1 via the third conveying means 403 of theunloader section UL, and the next electronic device conveying media 11and 12 are supplied to the first moving device 201 by the firstelectronic device conveying medium carrier CR1.

The third electronic device conveying medium 13 aligned and supplied bythe second electronic device conveying medium carrier CR2 is gripped bygrip heads 202 d of the second moving device 202 and moved to the secondrange 302 above the third contact group 113 and the fourth contact group114 by the second moving device 202.

Next, electronic devices to be tested 20 in a range from the first rowon the first column to the fourth row on the fourth column of thearrangement on the third electronic device conveying medium 13 in FIG.17 are moved to above the third contact group 113, and electronicdevices to be tested 20 in a range from the first row on the firstcolumn to the second row on the fourth column of the arrangement on thefourth electronic device conveying medium 14 are moved to above thefourth contact group 114 together at a time.

Next, 8 electronic devices 20 in a range from the first row on the firstcolumn to the second row on the fourth column of the arrangement of thethird electronic device conveying medium 13 are tested at the thirdcontact group 113, and 8 electronic devices 20 in a range from the firstrow on the first column to the second row on the fourth column of thearrangement of the fourth electronic device conveying medium 14 aretested at the fourth contact group 114 by the second moving device 202together at a time in the first round.

When the test is finished, the movable head 202 c having grip heads 202d holding the third electronic device conveying medium 13 and fourthelectronic device conveying medium 14 are elevated by the second movingdevice 202, then, moved to the Y-axis direction by an amount of tworows.

Next, 8 electronic devices 20 in a range from the third row on the firstcolumn to the fourth row on the fourth column of an arrangement on thethird electronic device conveying medium 13 are tested at the thirdcontact group 113, and 8 electronic devices 20 in a range from the thirdrow on the first column to the fourth row on the fourth column of anarrangement on the fourth electronic device conveying medium 14 aretested at the fourth contact group 114 by the second moving device 202together at a time in the second round.

When the test is finished, the movable head 202 c having grip heads 202d holding two electronic device conveying media, that is the thirdelectronic device conveying medium 13 and fourth electronic deviceconveying medium 14, are elevated by the second moving device 202, then,moved to the Y-axis direction by an amount of two rows.

After that, the operation is repeated, and the tests are conducted forfour times on the two electronic device conveying media 13 and 14 by thesecond moving device 202.

When the tests for four times in total are finished, the post-testedthird electronic device conveying medium 13 which comes first and thepost-tested fourth electronic device conveying medium 14 which comesfirst are discharged to the post-test electronic device stocker 802 andthe retest electronic device stocker 803 by the second electronic deviceconveying medium carrier CR2 via the third conveying means 403 of theunloader section UL, and the next electronic device conveying media 13and 14 are supplied to the second moving device 202 by the secondelectronic device conveying medium carrier CR2.

Accordingly, the test is conducted for four times in total on one offirst electronic device conveying media 1, one of second electronicdevice conveying media 12, one of third electronic device conveyingmedia 13 and one of fourth electronic device conveying media 14. Testson one of second electronic device conveying media 12, one of thirdelectronic device conveying media 13 and one of fourth electronic deviceconveying media 14 can be finished before tests on one of firstelectronic device conveying media 11 finish.

Note that test timing of the first moving device 201 and test timing ofthe second moving device 202 are synchronized by the main controller MCin the first moving device 201 and the second moving device 202, andtests are conducted at the same timing.

By controlling the two moving devices 201 and 202 independently by therespective sub controllers SC1 and SC2, and securing 8 test positions inthe first contact group 111, 8 test positions in the second contactgroup 112, 8 test positions in the third contact group 113, and 8 testpositions in the fourth conduct group 114, the simultaneously measurednumber of 32 limited in the electronic device testing apparatus 1 can bealways secured and a high testing efficiency can be realized.

As explained above, by optimally determining the number of contactgroups 110, the number and arrangement of contact portions 110 a in thecontact group 110 in accordance with an arrangement of electronicdevices to be tested 20 on the electronic device conveying medium 10 anda production plan, etc., and optimally determining the number ofmutually independent moving devices, contact groups corresponding to therespective moving devices, the number of electronic device conveyingmedium 10 able to be gripped by the respective moving devices, and thenumber of electronic device conveying media 10 gripped freely andindependently from other moving devices within the number able to begripped by the respective moving devices, the simultaneously measurednumber can be always secured while considering an occupying area,optimal facility costs, and optimal alignment accuracy, and a hightesting efficiency can be realized.

Particularly, by combining the number of mutually independent movingdevices, contact groups 110 corresponding to the respective movingdevices, the number of electronic device conveying media able to begripped by one moving device, and the number of electronic deviceconveying media 10 gripped freely and independently from other movingdevices within the number able to be gripped by the respective movingdevices, a conveying method can be flexibly matched to changes ofcircumstances, such as a production plan, in the same way as in thefirst embodiment.

Note that it is not limited to the test order of electronic devices tobe tested on an electronic device conveying medium explained in theabove first embodiment, and effective test orders of electronic devicesto be tested on an electronic device conveying medium are included.

Second Embodiment

FIG. 18 is a schematic view of a test head portion 100 and a detailedconfiguration around it of an electronic device testing apparatus 1 of asecond embodiment of the present invention.

The electronic device testing apparatus 1 of the present embodiment isan apparatus for testing (inspecting) whether electronic devices 20suitably operate or not in a state of being applied with a thermalstress of a high temperature or a low temperature to the electronicdevices to be tested 20 and classifying the electronic devices 20 inaccordance with the test results. Such an operation test in a state ofbeing applied with a thermal stress is conducted by conveying theelectronic device conveying medium 10 loaded with the electronic devicesto be tested 20 as test objects to inside the electronic device testingapparatus 1.

Note that the configuration of the electronic device testing apparatus 1of the present embodiment is the same as that in the first embodimentexcept for the test head portion 100.

Test Head Portion 100

The electronic device conveying medium 10 is supplied to the test headportion 100 by the first electronic device conveying medium carrier CR1or the second electronic device conveying medium carrier CR2, and theelectronic devices to be tested 20 are subjected to a test while beingloaded on the electronic device conveying medium 10.

The test head portion 100 comprises two contact groups, that is a firstcontact group 111 and a second contact group 112, for conducting a teston electronic devices to be tested 20 arranged on the electronic deviceconveying medium 10 supplied from the loader section LD; a first movingdevice 201 for controlling a position and posture of the electronicdevice conveying medium 10 loaded with electronic devices to be tested20 in a first range 301 covering above the first contact group 111 andthe second contact group 112 and a range including above the firstelectronic device conveying medium carrier CR1 above a first camera CM1;and a second moving device 202 for controlling a position and posture ofthe electronic device conveying medium 10 loaded with electronic devicesto be tested 20 in a first range 301 covering above the first contactgroup 111 and the second contact group 112 and a range including abovethe second electronic device conveying medium carrier CR2 above a secondcamera CM2, namely, in a partially overlapping range with that of thefirst moving device 201.

Note that although the operation ranges of the two moving devices 201and 202 partially overlap, they are controlled not to interfere withoperations of the other.

The first moving device 201 is a means for controlling positions of aplurality of electronic device conveying media 10 (two electronic deviceconveying media in FIG. 18) in the X-Y-Z axes directions and controllingpostures to the e-angle direction by using the Z-axis as a center axis.For example, it is configured to be movable in the first range 301covering above the first contact group 111 and second contact group 112and a range including the first electronic device conveying mediumcarrier CR1 above the first camera CM1 due to a rail 201 a providedalong the X-axis direction, a movable arm 201 b moving on the rail 201 ain the X-axis direction and a movable head 201 c supported by themovable arm 201 b and capable of moving in the Y-axis direction alongthe movable arm 201 b.

The movable head 201 c is movable also in the Z-axis direction (namely,in the vertical direction) by a not shown Z-axis actuator, furthermore,the θ-angle using the Z-axis as a center axis can be also controlled bya not shown posture control function. It is possible to grip, convey andrelease one or more electronic device conveying media 10 at a time bygrip heads 201 d (for example, 8 suction heads) provided to the movablehead 201 c.

One electronic device to be tested 20 on an electronic device conveyingmedium 10 corresponds to one contact 110 a, and respective electronicdevices to be tested 20 loaded on an electronic device conveying medium10 gripped by grip heads 201 d is applied a suitable pressure by anoperation of the movable head 201 c in the downward Z-axis direction andmade to contact not shown contact pins on the contact 110 a, so that atest is conducted. The test result is, for example, stored at an addressdetermined by an identification number attached to an electronic deviceconveying medium 10 and an electronic device number assigned inside theelectronic device conveying medium 10.

The first contact group 111 is composed of a set of contact portions 110a for conducting a test on electronic devices, and the second contactgroup 112 is also composed of a set of contact portions 110 a in thesame way. As far as the number of contact portions 110 a in total in anelectronic device testing apparatus 1 matches with the simultaneouslymeasured number limited in the electronic device testing apparatus 1(Normally, it is limited to 32 or 64), it is possible to determineoptimal number of contact group and optimal number and arrangement ofcontact portions 110 in the respective contact groups in accordance withthe number and arrangement of electronic devices to be tested 20 on theelectronic device conveying medium 10.

Namely, as far as the total number of contact portions 110 a of thefirst contact group 111 and second contact group 112 matches with thesimultaneously measured number of 32 or 64 limited in the electronicdevice testing apparatus 1, the number of contact portions 110 a in therespective contact groups 111 and 112 can be freely set.

Also, pitches between the respective contact portions 110 a in thecontact groups 111 and 112 have relationship of being identical withmultiples of pitches (including 1) between respective electronic devices20 arranged on electronic device conveying medium 10 corresponding tothe respective contact groups 111 and 112.

As to the basic configuration and operation of the second moving device202, it is a means for controlling positions of a plurality ofelectronic device conveying media 10 in the X-Y-Z axes directions andcontrolling a posture in the θ-angle direction using the Z-axis as acenter axis and, for example, it is configured to be able to move in afirst range 301 above the first contact group 111 and the second contactgroup 112 and a range including above the second electronic deviceconveying medium carrier CR2 above the second camera CM2 by a rail 202 aprovided along the X-axis direction, a movable arm 202 b moving on therail 202 a in the X-axis direction, and a movable arm 202 b supported bythe movable arm 202 b and movable along the movable arm 202 b in theY-axis direction in the same way as in the above first moving device201.

The movable head 202 c is movable in the Z-axis direction (that is, inthe vertical direction) by a not shown Z-axis actuator and, furthermore,control of the θ-angle using the Z-axis as a center axis is alsopossible by a not shown posture control function. Also, one or moreelectronic device conveying media 10 can be gripped, conveyed andreleased at a time by grip heads 202 d (for example, 8 suction heads)provided to the movable head 202 c.

In the above example, the explanation was made in premise that therewere two contact groups and two moving devices, and the number ofelectronic device conveying media 10 able to be gripped by the firstmoving device 201 and the second moving device 202 was two. But it isnot limited to this and the number of contact groups 110, and the numberand arrangement of contact portions 110 a in contact groups 110 can beoptimally determined (for example, one contact group 110 or three ormore contact groups 110) in accordance with the number and arrangementof electronic devices to be tested 20 on the electronic device conveyingmedium 10 and a production plan, etc. The number of the mutuallyindependent moving devices (for example, one moving device or three ormore moving devices), contact groups 110 corresponding to the respectivemoving devices, the number of electronic device conveying media 10 ableto be gripped by each moving device, the number of electronic deviceconveying media 10 gripped freely and independently from other movingdevices within the number able to be gripped by the respective movingdevices can be optimally set for each moving device.

Next, an operation will be explained. The electronic device conveyingmedium 10 loaded with electronic devices to be tested 20 aligned andsupplied by the first electronic device conveying medium carrier CR1 istested at the first contact group 111 and the second contact group 112by the first moving device 201.

Also, the electronic device conveying medium 10 aligned and supplied bythe second electronic device conveying medium carrier CR2 is tested atthe first contact group 111 and the second contact group 112 by thesecond moving device 202.

In this case, the first moving device 201 and the second moving device202 have partially overlapped operation ranges, but the operations arecontrolled not to interfere with each other.

Below, as shown in FIG. 18, a specific testing method will be explainedin the case of the simultaneously measured number of 32 using theelectronic device testing apparatus 1, wherein two electronic deviceconveying media 11 and 12 are gripped by the first moving device 201having grip heads 201 d capable of gripping two electronic deviceconveying media 11 and 12, and two electronic device conveying media 11and 12 are gripped by the second moving device 202 having grip heads 202d capable of gripping two electronic device conveying media 11 and 12.

Note that the electronic device conveying medium 11 indicates anelectronic device conveying medium loaded with electronic devices 20 tobe tested at the first contact group 111 and the electronic deviceconveying medium 12 indicates an electronic device conveying mediumloaded with electronic devices 20 to be tested at the second contactgroup 112 below.

FIG. 19 shows an arrangement of contact groups 110 in the case of thesimultaneously measured number of 32 corresponding to FIG. 18, whereinthe number of contact portions 110 a in the first contact group 111 isset to be 16 (four rows by four columns) and the number of contactportions 110 a in the second contact group 112 is set to be 16 (fourrows by four columns).

FIG. 20 shows test positions 21 in the first round on electronic devicesto be tested 20 arranged on the electronic device conveying medium 11corresponding to FIG. 19, wherein the first electronic device conveyingmedium 11 loaded with electronic devices 20 to be tested at the firstcontact group 111 and the second electronic device conveying medium 12loaded with electronic devices 20 to be tested at the second contactgroup 112 are shown.

Two electronic device conveying media, that is the first electronicdevice conveying medium 11 which comes first and the second electronicdevice conveying medium 12 which comes first, aligned and supplied bythe first electronic device conveying medium carrier CR1 are gripped bygrip heads 201 d of the first moving device 201 at a time and moved tothe first range 301 above the first contact group 111 and the secondcontact group 112 by the first moving device 201.

Next, the first moving device 201 moves electronic devices to be tested20 in a range from the first row on the first column to the fourth rowon the fourth column of the arrangement on the first electronic deviceconveying medium 11 in FIG. 20 to above the first contact group 111, andmoves electronic devices to be tested 20 in a range from the first rowon the first column to the fourth row on the fourth column of thearrangement on the second electronic device conveying medium 12 to abovethe second contact group 112 together at a time.

Next, the first moving device 201 conducts a test in the first round on16 electronic devices 20 in a range from the first row on the firstcolumn to the fourth row on the fourth column on the arrangement of thefirst electronic device conveying medium 11 and 16 electronic devices 20in a range from the first row on the first column to the fourth row onthe fourth column on the arrangement of the second electronic deviceconveying medium 12 together at a time.

When the test is finished, the movable head 201 c having grip heads 201d holding the first electronic device conveying medium 11 and the secondelectronic device conveying medium 12 is elevated by the first movingdevice 201, then, moved to the Y-axis direction by an amount of fourrows.

Next, the first moving device 201 conducts a test in the second round on16 electronic devices 20 in a range from the fifth row on the firstcolumn to the eighth row on the fourth column on the arrangement of thefirst electronic device conveying medium 11 and 16 electronic devices 20in a range from the fifth row on the first column to the eighth row onthe fourth column on the arrangement of the second electronic deviceconveying medium 12 together at a time, so that the test is conductedfor two times in total.

Accordingly, the test is conducted for two times on the first electronicdevice conveying medium 11 which comes first and the second electronicdevice conveying medium 12 which comes first together at a time.

While the above first moving device 201 conducts a test for two times intotal, a first electronic device conveying medium 11 which comes secondand a second electronic device conveying medium 12 which comes secondare supplied from the buffer portion 901 to the second electronic deviceconveying medium carrier CR2 via the second conveying means 402, and thesecond electronic device conveying medium carrier CR2 moves to above thesecond camera CM2, consequently, supply of the first electronic deviceconveying medium 11 which comes second and the second electronic deviceconveying medium 12 which comes second to the second moving device 202is prepared.

After the tests for two times in total on the first electronic deviceconveying medium 11 which comes first and the second electronic deviceconveying medium 12 which comes first are finished, the post-test firstelectronic device conveying medium 11 which comes first and thepost-test second electronic device conveying medium 12 which comes firstare discharged to the post-test electronic device stocker 802 or theretest electronic device stocker 803 by the first electronic deviceconveying medium carrier CR1 via the third conveying means 403 of theunloader section UL, and the electronic device conveying media 11 and 12which come second prepared by the second electronic device conveyingmedium carrier CR2 are supplied.

Next, two electronic device conveying media, that is the firstelectronic device conveying medium 11 which comes second and the secondelectronic device conveying medium 12 which comes second, aligned andsupplied by the second electronic device conveying medium carrier CR2are gripped by grip heads 202 d of the second moving device 202 at atime and moved to the first range 301 above the first contact group 111and the second contact group 112 by the second moving device 202.

Next, the second moving device 202 moves electronic devices to be tested20 in a range from the first row on the first column to the fourth rowon the fourth column of the arrangement on the first electronic deviceconveying medium 11 in FIG. 20 to above the first contact group 111, andmoves electronic devices to be tested 20 in a range from the first rowon the first column to the fourth row on the fourth column on the secondelectronic device conveying medium 12 to above the second contact group112 together at a time.

Next, the second moving device 202 conducts a test in the first round on16 electronic devices 20 in a range from the first row on the firstcolumn to the fourth row on the fourth column on the arrangement of thefirst electronic device conveying medium 11 and 16 electronic devices 20in a range from the first row on the first column to the fourth row onthe fourth column on the arrangement of the second electronic deviceconveying medium 12 together at a time.

When the test is finished, the movable head 202 c having grip heads 202d holding the first electronic device conveying medium 11 and the secondelectronic device conveying medium 12 is elevated by the second movingdevice 202, then, moved to the Y-axis direction by an amount of fourrows.

Next, the second moving device 202 conducts a test in the second roundon 16 electronic devices 20 in a range from the fifth row on the firstcolumn to the eighth row on the fourth column on the arrangement of thefirst electronic device conveying medium 11 and 16 electronic devices 20in a range from the fifth row on the first column to the eighth row onthe fourth column on the arrangement of the second electronic deviceconveying medium 12 together at a time, so that the test is conductedfor two times in total.

Accordingly, the test is conducted for two times on the first electronicdevice conveying medium 11 which comes second and the second electronicdevice conveying medium 12 which comes second at a time.

While the above second moving device 202 conducts a test for two timesin total, a first electronic device conveying medium 11 which comesthird and a second electronic device conveying medium 12 which comesthird are supplied from the buffer portion 901 to the first electronicdevice conveying medium carrier CR1 via the second conveying means 402,and the first electronic device conveying medium carrier CR1 moves toabove the first camera CM1, consequently, supply of the first electronicdevice conveying medium 11 which comes third and the second electronicdevice conveying medium 12 which comes third to the first moving device201 is prepared.

After the tests for two times in total on the first electronic deviceconveying medium 11 which comes second and the second electronic deviceconveying medium 12 which comes second are finished, the post-test firstelectronic device conveying medium 11 which comes second and thepost-test second electronic device conveying medium 12 which comessecond are discharged to the post-test electronic device stocker 802 orthe retest electronic device stocker 803 by the second electronic deviceconveying medium carrier CR2 via the third conveying means 403 of theunloader section UL, and the electronic device conveying media 11 and 12which come third prepared by the first electronic device conveyingmedium carrier CR1 are supplied.

After that, the above operation by the first moving device 201 and thesecond moving device 202 are repeated alternately.

As explained above, by securing 16 test positions in the first contactgroup 111 and securing 16 test positions also in the second contactgroup 112, it is possible to always secure the simultaneously measurednumber of 32 limited in the electronic device testing apparatus 1 and ahigh testing efficiency can be realized.

Furthermore, as a result that the first moving device 201 and the secondmoving device 202 operate alternately on the same first range 301, indextime occupying a part of the test rate of one moving device (theshortest time from an output of a start request signal by the handlerside to an output of the next start request signal) can be absorbed inthe test time of the other moving device. Particularly, when the testtime is short, since the ratio occupied by the index time in the testrate becomes large, high throughput can be realized by conducting a testin turn by a plurality of moving devices on a range wherein the contactgroup 110 exists as in the above example.

Note that in the second embodiment, the explanation was made on the twocontact groups 111 and 112, two moving devices 201 and 202 movable inthe first range 301 covering above the two contact groups 111, 112 andcapable of gripping two electronic device conveying media andindependently controllable, and two electronic device conveying mediumcarriers CR1 and CR2 for independently supplying an electronic deviceconveying medium 10 to the respective moving devices. But it is notlimited to these numbers and includes an electronic device testingapparatus comprising two or more contact groups 110 and two or moremoving devices capable of gripping two or more electronic deviceconveying media respectively and controlling independently, and havingthe two or more moving devices having a substantially overlappingoperation range on any one of contact groups.

Also, it is not limited to the test order of electronic devices to betested on the electronic device conveying medium explained in the abovesecond embodiment, and includes effective test orders of electronicdevices to be tested on the electronic device conveying medium.

Third Embodiment

In a test on electronic devices 20 on the wafers 701 and 702, there area few cases where test positions by the simultaneously measured numbercan be always secured in measurement on electronic devices 20 near theouter circumference of the wafer 701 and 702, and only less testpositions than the simultaneously measured number can be secured underpresent circumstances.

The present invention can be applied not only to the case of testing anelectronic device conveying medium 10, such as a strip format, describedin the first embodiment and the second embodiment, but to the case oftesting electronic devices 20 on the wafers 701 and 702, and iseffective for securing test positions by the simultaneously measurednumber.

As shown in FIG. 21, the test head portion 100 comprises four probergroups: a first prober group 601 and second prober group 602 having 28probers 600 a, and a third prober group 603 and fourth prober group 604having 4 probers 600 a, and the simultaneously measured number in thiscase is 64.

Note that the prober groups 601, 602, 603 and 604 are composed of a setof probers 600 a for conducting a test on electronic devices to betested 20 on the wafers 701 and 702.

Among respectively 72 electronic devices to be tested 20 (note thatthere is not an electronic device 20 near the outer circumferentialportion: at the first row on the first column, the first row on thesecond column, the first row on the eleventh column, the first row onthe twelfth column, the second row on the first column, the second rowon the twelfth column, the sixth row on the first column, the sixth rowon the twelfth column, the seventh row on the first column, the seventhrow on the second column, the seventh row on the eleventh column, andthe seventh row on the twelfth column) in arrangement of the seven rowsby twelve columns on the first wafer 701 and second wafer 702 suppliedfrom a loader section (not shown), 28 electronic devices 20 in a rangefrom the first row on the third column to the seventh row on the sixthcolumn at the first wafer 701 in the first prober group 601 and 28electronic devices 20 in the range from the first row on the thirdcolumn to the seventh row on the sixth column on the second wafer 702 atthe second prober group 602 as shown in FIG. 22 are tested in the firstround together at a time.

When the test is finished, a movable head (not shown) having grip headsholding the two wafers 701 and 702 at a time is elevated, then, moved tothe X-axis direction by an amount of four columns.

Next, 28 electronic devices 20 in a range from the first row on theseventh column to the seventh row on the tenth column on the first wafer701 are tested at the first prober group 601, and 28 electronic devices20 in a range from the first row on the seventh column to the seventhrow on the tenth column on the second wafer 702 are tested at the secondprober group 602 together at a time in the second round. Tests on 56electronic devices 20 in total as test positions 23 and 24 (the testpositions 23 and 24 in the first prober group 601 and the second probergroup 602 are sets of squares with a pattern in FIG. 22) in the firstprober group 601 and the second prober group 602 are completed bytwo-round tests in total, and the two wafers 701 and 702 are given tothe third prober group 603 and the fourth prober group 604.

Note that it is not limited to a method of giving the two wafers 701 and702 finished with the test at the first prober group 601 and the secondprober group 602 to the third prober group 603 and the fourth probergroup 604, but a method of giving to loader sections being independentto the respective prober groups may be considered.

After finishing the test in the first prober group 601 and the secondprober group 602, the two wafers 701 and 702 are moved to the thirdprober group 603 and the fourth prober group 604, two electronic devices20 at the second row on the second column and at the second row on theeleventh column on the first wafer 701 are tested at the third probergroup 603, and two electronic devices 20 on the second row on the secondcolumn and on the second row on the eleventh column on the second wafer702 are tested at the fourth prober group 604 together at a time in thefirst round.

When the test is finished, a movable head (not shown) holding the twowafers 701 and 702 is elevated, then, moved to the Y-axis direction byan amount of one row.

Next, four electronic devices 20 at the third line on the first row, atthe third line on the second row, at the third line on the eleventh rowand at the third line on the twelfth row on the first wafer 701 aretested at the third prober group 603, and four electronic devices 20 atthe third line on the first row, at the third line on the two row, atthe third line on the eleventh row and at the third line on the twelfthrow on the second wafer 702 are tested at the fourth prober group 604together at a time in the second round.

When the test is finished, a movable head holding the two wafers 701 and702 is elevated, then, moved to the Y-axis direction by an amount of onerow.

Next, four electronic devices 20 at the fourth row on the first column,at the fourth row on the second column, at the fourth row on theeleventh column and at the fourth row on the twelfth column on the firstwafer 701 are tested at the third prober group 603, and four electronicdevices 20 at the fourth row on the first column, at the fourth row onthe second column, at the fourth row on the eleventh column and at thefourth row on the twelfth column on the second wafer 702 are tested atthe fourth prober group 604 together at a time in the third round.

When the test is finished, a movable head holding the two wafers 701 and702 is elevated, then, moved to the Y-axis direction by an amount of onerow.

Next, four electronic devices 20 at the fifth row on the first column,at the fifth row on the second column, at the fifth row on the eleventhcolumn and at the fifth row on the twelfth column on the first wafer 701are tested at the third prober group 603, and four electronic devices 20at the fifth row on the first column, at the fifth row on the secondcolumn, at the fifth row on the eleventh column and at the fifth row onthe twelfth column on the second wafer 702 are tested at the fourthprober group 604 together at a time in the third round.

When the test is finished, a movable head holding the two wafers 701 and702 is elevated, then, moved to the Y-axis direction by an amount of onerow.

Next, two electronic devices 20 at the sixth row on the second columnand at the sixth row on the eleventh column on the first wafer 701 aretested at the third prober group 603, and two electronic devices 20 atthe sixth row on the second column and at the sixth row on the eleventhcolumn on the second wafer 702 are tested at the fourth prober group 604together at a time. Tests on 16 electronic devices 20 in total as testpositions 25 and 26 (the test positions 25 and 26 in the third probergroup 603 and the fourth prober group 604 are sets of squares with apattern in FIG. 23) in the third prober group 603 and the fourth probergroup 604 are completed by five rounds in total.

After finishing the test in the third prober group 603 and the fourthprober group 604, the two wafers 701 and 702 are given to the unloadersection (not shown), and next wafers 701 and 702 are supplied from thefirst prober group 601 and the second prober group 602 or from loadersections being independent for respective prober groups.

Note that test timing in the first prober group 601 and second probergroup 602 and test timing in the third prober group 603 and fourthprober group 604 are synchronized in the respective moving devices bythe main controller MC (not shown), and the tests are conducted at thesame timing.

As explained above, when conducting a test on electronic devices 20 onthe wafers 701 and 702, by dividing to the first prober 601 and thesecond prober group 602 for testing on the electronic devices 20existing at the center of the wafers 701 and 702 and to the third probergroup 603 and the fourth prober group 604 for testing on the electronicdevices 20 existing near the outer circumference, test positions closeto the simultaneously measured number of 64 can be secured, and a hightest efficiency can be realized in a test on electronic devices to betested 20 on the wafers 701 and 702 near the outer circumference wheretest positions by the simultaneously measured number can be hardlysecured.

Note that in the above embodiment, a method of gripping a wafer by gripheads and moving a movable head having the grip heads was applied, butit is not limited to this method and, for example, a method of fixingthe wafer and performing alignment control on prober groups with respectto the electronic devices may be also considered.

Note that in the third embodiment, four prober groups 601, 602, 603 and604, and a moving device capable of gripping two wafers 701 and 702 wereexplained, but the numbers are not limited to these, and an electronicdevice testing apparatus comprising one to three prober groups or fiveor more prober groups, and a moving device capable of gripping two ormore wafers is included. It is not limited to the test order ofelectronic devices to be tested on the electronic device conveyingmedium explained in the third embodiment, and effective test orders ofelectronic devices to be tested on the electronic device conveyingmedium are included.

Note that the embodiments explained above are described to facilitateunderstanding of the present invention and is not to limit the presentinvention. Accordingly, respective elements disclosed in the aboveembodiments include all design modifications and equivalents belongingto the technical scope of the present invention.

For example, in the case of the first embodiment, other than the methodof covering the whole test head portion 100 with a chamber forconducting a test in a state of applying a thermal stress, a method ofapplying a heat plate to the buffer portion and other methods may beconsidered, and the electronic device testing apparatus of the presentinvention includes them.

Note that the simultaneously measured numbers in the embodiments of thepresent invention are not limited to the above numbers and may beapplied to simultaneously measured numbers of 2^(n).

1. An electronic device testing apparatus, for conducting a test bypressing input/output terminals of electronic devices to be testedagainst contact portions of a test head by a moving means while saidelectronic devices to be tested are loaded on an electronic deviceconveying medium, comprising: one or a plurality of said moving meanscapable of gripping and conveying to and from said contact portions aplurality of said electronic device conveying media loaded with saidelectronic devices to be tested at a time.
 2. The electronic devicetesting apparatus as set forth in claim 1, wherein said moving means iscapable of freely selecting the gripping number within the number ableto be gripped.
 3. The electronic device testing apparatus as set forthin claim 1, wherein said one moving means is capable of freely selectingthe gripping number being independent from other moving means.
 4. Theelectronic device testing apparatus as set forth in claim 1, whereinsaid any two or more moving means among said plurality of moving meanshave a substantially overlapping operation range on a contact group as aset of said contact portions.
 5. The electronic device testing apparatusas set forth in any one of claims 1 to 4, wherein said electronic deviceconveying medium is a strip format or a wafer.
 6. The electronic devicetesting apparatus as set forth in any one of claims 1 to 4, wherein eachof said moving means grips said electronic device conveying mediumloaded with said electronic devices to be tested and moves from aloading position of pre-test electronic devices to said contactportions.
 7. The electronic device testing apparatus as set forth in anyone of claims 1 to 4, wherein each of said moving means grips saidelectronic device conveying medium loaded with said electronic devicesto be tested and moves from said contact portions to a loading positionof post-test electronic devices.
 8. The electronic device testingapparatus as set forth in any one of claims 1 to 4, wherein a sum of thenumbers of contact portions in said test head is 2^(n) (“n” is a naturalnumber).
 9. The electronic device testing apparatus as set forth inclaim 8, wherein n=5.
 10. The electronic device testing apparatus as setforth in claim 8, wherein n=6.